Smd Components Identification Pdf
The SMD components does not have a clear description. Since a tiny size of the components, they are labelled with one, two or more character or graphic SMD code. Therefore a sure identification of the components is impossible without appropriate technical documentation. Moreover the polarity and pin - outs of different components could be.
SMD (Surface Mount Device): Surface Mount Electronic Components for SMTThe package types and package and lead configurations available are numerous. In addition, the requirements of surface mount components are far more demanding.
SMD or SMCs must withstand the higher soldering temperatures and must be selected, placed, and soldered more carefully to achieve acceptable manufacturing yield.There are scores of components available for some electrical requirements, causing a serious problem of component proliferation. There are good standards for some components, whereas for others standards are inadequate or nonexistent. Some electronic components are available at a discount, and others carry a premium. While has matured, it is constantly evolving as well with the introduction of new packages.
Smd Components Identification Pdf Example
The electronics industry is making progress every day in resolving the economic, technical, and standardization issues with surface mount components. SMD are available as both. Passive SMD ComponentsThe world of passive surface mounting is somewhat simpler. Monolithic ceramic capacitors, tantalum capacitors, and thick film resistors form the core group of passive SMD. The shapes are generally rectangular and cylindrical. The mass of the components is about 10 times lower than their through-hole counterparts.The surface mount resistors and capacitors come in various case sizes to meet the needs of various applications in the electronics industry.
While there is a trend toward shrinking case sizes, larger case sizes are also available if capacitance requirements are large. These devices/ components come in both rectangular and tubular ( MELF: metal electrode leadless face) shapes. Passive Surface Mount Electronic Components Surface Mount Discrete Resistors (SMD Resistor)There are two main types of: thick film and thin film.Thick film surface mount resistors are constructed by screening resistive film (ruthenium dioxide based paste or similar material) on a flat, high purity alumina substrate surface as opposed to depositing resistive film on a round core as in axial resistors. The resistance value is obtained by varying the composition of resistive paste before screening and laser trimming the film after screening.In thin film resistors the resistive element on a ceramic substrate with protective coating ( glass passivation) on top and solderable terminations ( tin-lead) on the sides.
The terminations have an adhesion layer ( silver deposited as thick film paste) on the ceramic substrate, and nickel barrier underplating followed by either dipped or plated solder coating. The nickel barrier is very important in preserving the solderability of terminations because it prevents leaching ( dissolution) of the silver or gold electrode during.Resistors come in 1/16, 1/10, 1/8 and ¼ watt ratings in 1 ohm to 100 megaohm resistance in various sizes and various tolerance. Commonly used sizes are: 0402, 0603, 0805, 1206, and 1210. A surface mount resistor has some form of colored resistive layer with protective coating on one side and generally a white base material on the other side. Thus the outer appearance offers a simple way to distinguish between resistors and capacitors. Surface Mount Resistor Networks Ceramic Capacitors for SMTare ideal for high frequency circuit applications because it does not have any leads and can be placed underneath the package on the opposite side of the. The most widely used packaging for ceramic capacitors is 8 mm tape and reel.Surface mount capacitors are used for both decoupling applications and for frequency control.
Multilayer monolithic ceramic capacitors have improved volumetric efficiency. They are available in different dielectric types per EIA RS-198n, namely COG or NPO, X7R, Z5U, and Y5V.Surface mount capacitors are highly reliable and has been used in high volumes in under-the-hood automotive applications, military equipments and aerospace applications.
Surface Mount Ceramic Capacitor Surface Mount Tantalum CapacitorsFor Surface Mount capacitors, the dielectric can either be ceramic or tantalum.Surface mount tantalum capacitors offer very high volumetric efficiency or a high capacitance-voltage product per unit volume and high reliability.The wrap-under lead capacitors, commonly called plastic molded tantalum capacitors, have leads instead of terminations and a beveled top as a polarity indicator. There are no soldering or placement concerns when using the molded plastic tantalum capacitors. They are available in two case sizes – standard and extended range.The capacitance value for tantalum capacitors vary from 0.1 to 100 µF and from 4 to 50 V dc in different case sizes. They can also be custom made as per the requirement of the application.
Tantalum capacitors are available with or without marked capacitance values in bulk, in waffle packs, and on tape and reel. Surface Mount Tantalum Capacitors Tubular Passive SMD Components for SMTThe cylindrical devices known as metal electrode leadless faces (MELFs) are used for resistors, jumpers, ceramic and tantalum capacitors, and diodes. They are cylindrical and have metal ends caps for soldering.Since MELFs are cylindrical, the resistors do not have to be placed with resistive elements away from the board surface as is the case with the rectangular resistors. MELFs are less expensive. Like the conventional axial devices, MELFs are color coded for values.
MELF diodes are identified as MLL 41 and MLL 34. MELF resistors are identified as 0805, 1206, 1406 and 2309. SMD Tubular Passive Components SMD Active Components for SMT Leadless Ceramic Chip Carriers (LCCC), Ceramic Leaded Chip Carriers (CLCC)Surface mounting offers more types of active and passive packages than through-hole technology.Here are all the various categories of active surface mount component packages:Leadless Ceramic Chip Carriers (LCCC): As the name indicates, leadless chip carriers have no leads. Instead they have gold plated, groove-shaped terminations known as castellations that provide shorter signal paths allowing higher operating frequencies. The LCCCs can be divided into different families depending on the pitch of the package. The most common is 50 mil (1.27 mm) family. Others are 40, 25 and 20 mil families.
Ceramic Leaded Chip Carrier (CLCC) SMD Active Components for SMT (Plastic Packages)As discussed above, ceramic packages are expensive and are used primarily for military applications. Plastic SMD packages, on the other hand, are most widely used packages for nonmilitary applications, where hermiticity is not required. The ceramic packages have solder joint cracking due to between the package and the substrate, but the plastic packages are also not trouble free.Here are all the Active SMD Components (Plastic Packages):Small Outline Transistors (SOT)Small Outline Transistors are one of the forerunners of active devices in surface mounting. They are three- and four-lead devices.
The three-lead SOTs are identified as SOT 23 (EIA TO 236) and SOT 89 (EIA TO 243). The four-lead device is known as SOT 143 (EIA TO 253).These packages are generally used for diodes and transistors. The SOT 23 and SOT 89 packages have become almost universal for surface mounting small transistors. Even as the use of high pin count complex integrated circuits is becoming widespread, the demand for various types of SOTs and SODs continue to grow. Small Outline Transistors (SOT)Small Outline Integrated Circuit (SOIC and SOP)The small outline integrated circuit (SOIC or SO) is basically a shrink package with leads on 0.050 inch centers.
It is used to house larger integrated circuits than is possible in SOT packages. In some cases, SOICs are used to house multiple SOTs.SOIC contains leads on two sides that are formed outward in what is generally called gull wing lead. SOICs need to be handled carefully to prevent lead damage. SOICs come in mainly two different body widths: 150 mil 300 mils.
The body width of packages having fewer than 16 leads is 150 mil; for more than 16 leads, 300 mil widths is used. The 16 lead packages come in both body widths. Fine Pitch SMD Packages (QFP, SQFP)Ball Grid Array (BGA)is an array package like PGA (pin grid array) but without the leads.There are various types of BGAs, but the main categories are ceramic and plastic BGA. The ceramic BGAs are called CBGA (Ceramic Ball Grid Array) andCCGA (Ceramic Column Grid Array), and the plastic BGAs are referred to as PBGA. Final draft 11 crack. There is another category of BGA known as tape BGA (TBGA). The ball pitches have been standardized at 1.0, 1.27, and 1.5 mm pitch. (40,50, and 60 mil pitch).
The body sizes of BGAs vary from 7 to 50 mm and their pin counts vary from 16 to 2400. Most common BGA pin counts range between 200 and 500 pins.BGAs are very good for self alignment during reflow even if they are misplaced by 50% (CCGA and TBGA do not self align as well as PBGAs and CBGAs do). This is one reason for the higher yield with BGAs. Electronics Tutorial Website The Best Blog to Learn Basic Electronics Tutorial for Beginners.
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Step 1) Identify the package, note how many pins, match up the pins first. Note that sometimes the package pins are underneath the part or extended away from the part.
Also get the dimensions of the part with a ruler or (preferably) calipers and match them up with a chart, write them down for a later step. Make sure that when measuring pin pitches (distance between pins) that this is done accurately, it can be difficult to tell (for example) the difference between a 1mm pitch to a 1.25mm pitch. Make sure the measurement is precise, or measure across multiple pins and divide by the number of pins to get the pin pitch.Package dimensions are standardized or they can also be found by searching for the package type on google and comparing dimensions. Package dimensions can also be found at manufactures websites in datasheets (or sometimes in files separate from datasheets, it might take some hunting around to find them)Here are some or use this below:Source:Step 2) Identify all markings on the top of the component. These markings include: Manufacturer Logo andor SMT code.If you are unsure of character differences, make sure these are noted. E.g.: 8 could be mistaken for B. That means if you have A32B it could be mistaken for A328.
Smd Components Identification Pdf Example
If you're unsure, you will need to search for both. Here are some sources where you can find them:.You can find many IC manufacturer logo's using or the picture below:Source:Step still can't find it 3) So what do you do at this point if you can't find what your part is? There are still lots of options. Use what you know about the part.A manufacture logo or mark on the package can be really helpfull to identify the package. Use parametric searches at the manufacturer's website and package information to narrow down the number of parts. For example: if I thought the part was an opamp with 5 pins and I knew the manufacturer was TI, I would go to TI's website and run a parametric search that looks for all of the opamps with 5 pin packages.Then start checking datasheets as most of the leading manufactures provide SMT codes in datasheets with the package information.
If it is an old part, a search through old datasheets or maybe an email to the manufacturer might be the way to clarify the part. Many manufacturers have also SMD code lists.The more certainty you have of the package type (or narrowed it down to a few packages) and you think you know what the part does, you can use a distributor search (such as, or ) to narrow down what the part is. This allows you to pull up a datasheet and check.I have also found extremely vague parts on google just by the package and the SMD number. I tried different combinations of packages (I had two choices), and after some google sleuthing, I narrowed it down to 3 parts.